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Properties of flash-evaporated gallium arsenide and gallium phosphide epitaxial films

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Title Properties of flash-evaporated gallium arsenide and gallium phosphide epitaxial films
Names Matsuo, Samuel Seiji (creator)
Looney, James C. (advisor)
Date Issued 1967-07-05 (iso8601)
Note Graduation date: 1968
Abstract The properties of flash- evaporated films of GaAs
and GaP were studied in this investigation. Films were
grown at various substrate temperatures, source temperatures,
source-to-substrate distances and rates of deposition
and were evaluated as to their structural,
optical and electric properties.
It was found that substrate temperature was the
major factor in determining the crystallinity of the
films. Films deposited below about 250°C were found to
be amorphous. As the substrate temperature was increased,
the crystallinity of the films improved.
The optical data showed that the films had band
gaps in the range of 1.34 to 1.72 ev. for GaAs films.
Temperature-versus-resistivity measurements showed that
the band gap for GaAs films varied from 1.18 ev. to
1.72 ev. The value for bulk GaAs is 1.47 ev. Films grown from evaporant powders obtained by
crushing wafers of 6x10⁻³ ohm-cm to 0.01 ohm-cm material
had very high resistivities. To lower film resistivity,
additional doping was incorporated in the evaporant.
Tin was added to n-type wafers and zinc to p-type wafers.
The films grown from the tin-rich evaporant powders
showed a decrease in resistivity for an increase in tin
concentration and an increase in resistivity for a decrease
in substrate temperature. Films grown from zinc-rich powders had high resistivities in all cases.
Hall measurements were made but most films showed
no voltage above the noise level of the measuring apparatus.
The highest mobility value calculated from those
films that exhibited Hall voltage was 0.7 cm²/volt-sec,
far below the value of 8500 cm²/volt-sec for bulk GaAs.
Electroluminescence was noted in high-resistivity
GaP films grown on GaAs substrates. A wide spectral
emission energy band was measured which would indicate
an avalanche process as being the carrier injection
mechanism.
Point- contact and evaporated diodes were fabricated
from the flash-evaporated films. Large leakage currents
were noted in both types of diodes.
Genre Thesis/Dissertation
Topic Metallic films
Identifier http://hdl.handle.net/1957/47148

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