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Vacuum evaporated dielectrics in MOS structures

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Title Vacuum evaporated dielectrics in MOS structures
Names Delzer, Dennis Richard (creator)
Looney, James C. (advisor)
Date Issued 1968-08-27 (iso8601)
Note Graduation date: 1969
Abstract Vacuum evaporated dielectrics for use in MOS structures
were studied in this research project. Dielectric
films were deposited on substrates by electron bombardment
evaporation of sapphire and quartz source materials.
These deposited films were studied using infrared spectroscopy,
index of refraction, density, and dielectric constant
measurements. Etching tests were also conducted on
the dielectric films. Annealing these films was also
tried. From the results of these tests, it was concluded
that suitable aluminum oxide and silicon dioxide films can
be obtained by e-Gun evaporation. The best results were
obtained for slowly evaporated films on substrates heated
above 200° C. Better films were obtained after annealing
for ten minutes at 1100°C in dry nitrogen.
The diffusion masking properties of the e-Gun evaporated
silicon dioxide and aluminum oxide films were
studied. The evaporated films were tested for the masking
of phosphorus and boron diffusion into silicon, of gallium
and indium diffusion into germanium, and of zinc diffusion
into gallium arsenide. From the results of these tests,
it was concluded that both of these e-Gun evaporated films
will effectively mask the diffusion of all the above mentioned
impurities. The aluminum oxide films were better
diffusion masks because they were more impervious to the
diffusion of impurities. It required significantly
thinner films of aluminum oxide to effectively mask the
diffusion of all the impurities studied.
The e-Gun evaporated films were used to fabricate
MOS capacitors. Both aluminum oxide and silicon dioxide
films produced good capacitors. The threshold voltages
and surface-state densities of the capacitors were studied.
Aluminum oxide films produced MOS capacitors which were
relatively stable under bias-temperature tests.
The e-Gun evaporated films were used in the fabrication
of MOS transistors. The electrical properties of
these transistors were studied using I-V characteristics.
Both dielectrics produced good MOS transistors. Aluminum
oxide films produced transistors with transconductances
which were twice as large as the transconductances of the
transistors with silicon dioxide films of the same thickness. The aluminum oxide films produced transistors
which were relatively stable under bias-temperature tests,
a possible reason for this being that impurity ions are
less mobile in it than in silicon dioxide.
Genre Thesis/Dissertation
Topic Transistors
Identifier http://hdl.handle.net/1957/46875

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